AZB & Partners acted as a legal counsel for Indian Semiconductor Mission and Deloitte in connection with the grant of fiscal incentive of INR 1532 crores to India Chip Private Limited, a joint venture company Vama Sundari Investments (Delhi) Private Limited and Foxconn Hon Hai Technology India Mega Development Private Limited, for the establishment of a greenfield wafer level packaging- gold bump project in Jewar, Noida, Uttar Pradesh. The facility will have a committed capacity of 20,000 units per month for wafer level packaging and 20,000 units per month for chip probing and 36 million units per month die processing service. The total estimated project cost is approximately INR 3,706.15 crores.
The team was led by our Partner Mallika Anand and Associate Tanishq Khandelwal. Special thanks to our Senior Partners Anuja Tiwari and Raman Sharma for their continued guidance.
Originally published 25 August,2026